PRODUCTS
Plain Resin Kit
Epoxy Embedding Kit
Easy to use without loss of hardener due to the mixing ration of 1: 1 per weight.
Low viscosity allows better impregnation into porous structure:
flexible and has plasticity.
Complete Polymerization
For ultra-thin slices, `50 nm thick, swelling takes place while the slices are floating after cutting, in a knife boat filled with distilled water before being collected onto the grid,
Such swelling can be minimized through complete polymerization of resin.
395 Plain Resin Kit
Plain Resin A (base resin) : 200g x 2
Plain Resin B (hardener) : 200g x 2
Plain Resin C (accelerator) : 20g x 1
cross-sectional observation of new leaf Photinia serrulata
x100 x800
Pictures provider : Dr.Isao Yoshihama , Laboratory of Electron Microscopy, Tokyo Medical University
Preparation
100ml75ml60ml50ml45ml40ml30ml25ml20ml
Plain Resin A58.5g43.9g35.1g29.3g26.3g23.4g17.6g14.6g11.7g
Plain Resin B58.5g43.9g35.1g29.3g26.3g23.4g17.6g14.6g11.7g
Plain Resin C2.13g1.60g1.28g1.07g0.96g0.85g0.64g0.53g0.43g
Easy to use without loss of hardener due to the mixing ration of 1: 1 per weight
Substitution with Plain Resin after Dehydration
Mixture of Plain Resin : QY-1(or PO) = 1 : 3 (29.2g : 75g)
Mixture of Plain Resin : QY-1(or PO) = 1 : 1 (58.6g : 50g)
Mixture of Plain Resin : QY-1(or PO) = 3 : 1 (87.8g : 25g)
Polymerization
Polymerization time is one night at 50 and 3 days at 65.
For complete polymerization, curing at 70 for 4`5 days is recommended.
All types of capsules for encapsulation can be used.
Copyright (C) 2012 Nisshin EM Co.,Ltd. All Rights Reserved.